EEMS Package portfolio
Packages are an integral part of the basic functionality of semiconductors and contribute to their overall performance. Historically, we have provided services for the memory semiconductor market. However many packages, and related technologies, can also be used for non-memory devices such as logic, DSP and ASIC. We offer several types of leaded packages as well as the most recent, more sophisticated, CSP packages in the form of BGA (Ball Grid Array).
Ball Grid Array (BGA)
FBGA
Memory Type
DRAM & NAND Flash
Applications
Laptops, MP3 players, cellular phones, PC Graphics, etc...
MCP - PoP
Memory Type
DRAM Stacks / Combo device
Applications
Blade servers, smartphones, blackbarry, etc...
NAND Storage
MultiMediaCard
Memory Type
NAND
Applications
Laptops, MP3 players, cellular phones, PC Graphics, etc...
Secure Digital
Memory Type
NAND Flash
Applications
Digital camera, MP3 players, Smart phones, PDAs
Micro SD
Memory Type
NAND Flash
Applications
Cellular phones
Leaded Packages
TSOP I
Memory Type
NAND & NOR Flash
Applications
Portable devices, cellular phones, MP3 players, etc...
TSOP II
Memory Type
SDRAM DDR DRAM
Applications
Consumer legacy, STB, DVD, Games, PC Graphics, etc...
