Multi Die Products (MDP) in FD-fBGA

EEMS is active on those solutions and has additional on-going projects. Several solutions are being explored for DDRII DRAMs that have more geometrical, electrical, thermal and reliability requirements when compared with previous DRAM generations.

Wire bonding capabilities

• Stacking dies will pose several challenges to wire bonding technology and capability:
  • Smaller wire die (down to 20-18um)
  • Ball bumping and reverse bonding
  • Long wires (up to 7mm)
  • Low loops (as low as 60 um)
  • Cascade bonding
  • Bonding in several steps, on more planes
  • Die-to-Die bonding

Long wires (up to 7mm)

Ball bumping and reverse bonding

Low loops (as low as 60 um)

Cascade bonding